ddelisle t1_ir1tm30 wrote on October 4, 2022 at 6:40 PM

All these new fabs that will be built in the USA: the chips will be sent to China/India/Taiwan/etc. to be installed into devices? Or will the devices be sent to USA for completion? Just curious how this is all going to play out.

AnacondaPimpHand t1_ir1y6zt wrote on October 4, 2022 at 7:08 PM

The chips coming out of these fabs are still in wafer form. They are shipped to another factory for “dicing”. Dicing is a much simpler process than the actual manufacture of the chips so I believe most of it is done overseas (cost saving).

DePasse t1_ir4e2r1 wrote on October 5, 2022 at 6:55 AM

Following the dicing packaging needs to be done as well. Purely diced dies are not usable as they cannot be integrated into usual electronics without a first level package for most use cases.